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17 July 2015 Quantitative phase measurement for wafer-level optics
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Proceedings Volume 9524, International Conference on Optical and Photonic Engineering (icOPEN 2015); 95242J (2015)
Event: International Conference on Optical and Photonic Engineering (icOPEN2015), 2015, Singapore, Singapore
Wafer-level-optics now is widely used in smart phone camera, mobile video conferencing or in medical equipment that require tiny cameras. Extracting quantitative phase information has received increased interest in order to quantify the quality of manufactured wafer-level-optics, detect defective devices before packaging, and provide feedback for manufacturing process control, all at the wafer-level for high-throughput microfabrication. We demonstrate two phase imaging methods, digital holographic microscopy (DHM) and Transport-of-Intensity Equation (TIE) to measure the phase of the wafer-level lenses. DHM is a laser-based interferometric method based on interference of two wavefronts. It can perform a phase measurement in a single shot. While a minimum of two measurements of the spatial intensity of the optical wave in closely spaced planes perpendicular to the direction of propagation are needed to do the direct phase retrieval by solving a second-order differential equation, i.e., with a non-iterative deterministic algorithm from intensity measurements using the Transport-of-Intensity Equation (TIE). But TIE is a non-interferometric method, thus can be applied to partial-coherence light. We demonstrated the capability and disability for the two phase measurement methods for wafer-level optics inspection.
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Weijuan Qu, Yongfu Wen, Zhaomin Wang, Fang Yang, Lei Huang, and Chao Zuo "Quantitative phase measurement for wafer-level optics", Proc. SPIE 9524, International Conference on Optical and Photonic Engineering (icOPEN 2015), 95242J (17 July 2015);

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