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17 July 2015 Phase shift reflectometry for wafer inspection
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Proceedings Volume 9524, International Conference on Optical and Photonic Engineering (icOPEN 2015); 95242T (2015) https://doi.org/10.1117/12.2190644
Event: International Conference on Optical and Photonic Engineering (icOPEN2015), 2015, Singapore, Singapore
Abstract
In 3D measurement, specular surfaces can be reconstructed by phase shift reflectometry and the system configuration is simple. In this paper, a wafer is measured for industrial inspection to make sure the quality of the wafer by calibrating, phase unwrapping, slope calculation and integration. The profile result of the whole wafer can be reconstructed and it is a curve. As the height of the structures on the wafer is the target we are interested in, by fitting and subtracting the curve surface, the structures on the wafer can be observed on the flat surface. To confirm the quality farther, a part of the wafer is captured and zoomed in to be detected so that the difference between two structures can be observed better.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kuang Peng, Yiping Cao, Hongru Li, Jianfei Sun, Thomas Bourgade, and Anand Krishna Asundi "Phase shift reflectometry for wafer inspection", Proc. SPIE 9524, International Conference on Optical and Photonic Engineering (icOPEN 2015), 95242T (17 July 2015); https://doi.org/10.1117/12.2190644
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