22 June 2015 Expanded beam spectro-ellipsometry for big area on-line monitoring
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Abstract
Non-destructive analysing tools are needed at all stages of thin film process-development, especially photovoltaic (PV) development, and on production lines. In the case of thin films, layer thicknesses, micro-structure, composition, layer optical properties, and their uniformity are important parameters. An important focus is to express the dielectric functions of each component material in terms of a handful of wavelength independent parameters whose variation can cover all process variants of that material. With the resulting database, spectroscopic ellipsometry coupled with multilayer analysis can be developed for on-line point-by-point mapping and on-line line-by-line imaging. Off-line point-by-point mapping can be effective for characterization of non-uniformities in full scale PV panels or big area (even 450 mm diameter) Si-wafers in developing labs but it is slow in the on-line mode when only 15 points can be obtained (within 1 min) as a 120 cm long panel moves by the mapping station. Last years [M. Fried et al, Thin Solid Films 519, 2730 (2011)], a new instrumentation was developed that provides a line image of spectroscopic ellipsometry (wl=350- 1000 nm) data. Earlier a single 30 point line image could be collected in 10 s over a 15 cm width of PV material. Recent years we have built a 30, a 45 and a 60 cm width expanded beam ellipsometer which speed is increased by 10x. Now, 1800 points can be mapped in a 1 min traverse of a 60*120 cm PV panel or flexible roll-to-roll substrate.
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M. Fried, M. Fried, C. Major, C. Major, G. Juhasz, G. Juhasz, P. Petrik, P. Petrik, Z. Horvath, Z. Horvath, } "Expanded beam spectro-ellipsometry for big area on-line monitoring", Proc. SPIE 9525, Optical Measurement Systems for Industrial Inspection IX, 95251S (22 June 2015); doi: 10.1117/12.2184713; https://doi.org/10.1117/12.2184713
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