Paper
14 July 2015 Improving UV laser damage threshold of fused silica optics by wet chemical etching technique
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Abstract
Fused silica is widely used in high-power laser systems because of its good optical performance and mechanical properties. However, laser damage initiation and growth induced by 355 nm laser illumination in optical elements have become a bottleneck in the development of high energy laser system. In order to improve the laser-induced damage threshold (LIDT), the fused silica optics were treated by two types of HF-based etchants: 1.7%wt. HF acid and buffer oxide etchant (BOE: the mixture of 0.4%wt. HF and 12%wt. NH4F), respectively, for varied etching time. Damage testing shows that both the etchants increase the damage threshold at a certain depth of material removal, but further removal of material lowers the LIDT markedly. The etching rates of both etchants keep steady in our processing procedure, ~58 μg/min and ~85 μg/min, respectively. The micro-surface roughness (RMS and PV) increases as etching time extends. The hardness (H) and Young’s modulus (E) of the fused silica etched for diverse time, measured by nano-indenter, show no solid evidence that LIDT can be related to hardness or Young’s modulus.
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Hui Ye, Yaguo Li, Zhigang Yuan, Jian Wang, Qiao Xu, and Wei Yang "Improving UV laser damage threshold of fused silica optics by wet chemical etching technique", Proc. SPIE 9532, Pacific Rim Laser Damage 2015: Optical Materials for High-Power Lasers, 953221 (14 July 2015); https://doi.org/10.1117/12.2186007
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Cited by 10 scholarly publications.
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KEYWORDS
Silica

Etching

Laser induced damage

Laser damage threshold

Cerium

HF etching

Resistance

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