4 May 2015 Ultrasonic guided wave based horizontal crack imaging in metal plate by local wavenumber analysis
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Proceedings Volume 9543, Third International Symposium on Laser Interaction with Matter; 95430F (2015) https://doi.org/10.1117/12.2182199
Event: Third International Symposium on Laser Interaction with Matter, 2014, Jiangsu, China
Abstract
Ultrasonic guided waves are one of the most prominent tools for SHM in plate-like structure. However, complex propagation characteristics of guided waves as well as traditional contact ultrasonic transducers limit its application in the practical damage detection. Scanning Laser Doppler vibrometer (SLDV) technology is an effective non-contact method to obtain ultrasonic guided wavefield with ultra-high spatial resolution. Based on abundant wavefield data, wavenumber imaging algorithms are capable of not only damage location, but also assessment of damage characteristics such as size and shape. In this work, we adopt local wavenumber analysis method for horizontal crack detection in platelike structure. Instead of using SLDV in experiment, 3D finite element numerical method is adopted to obtain full ultrasonic guided wavefield data. Since the horizontal cracks result in decrease of local thickness, the wavenumber in corresponding area shows significant increase, which is used as indicators for crack imaging. The effects of different damage shapes, depths and spatial window sizes on imaging are also discussed. Numerical simulation results and imaging algorithm laid the foundation for the method applied in experiment and practice.
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C. G. Xu, C. G. Xu, B. Q. Xu, B. Q. Xu, Y. Luo, Y. Luo, G. D. Xu, G. D. Xu, F. G. Yuan, F. G. Yuan, } "Ultrasonic guided wave based horizontal crack imaging in metal plate by local wavenumber analysis", Proc. SPIE 9543, Third International Symposium on Laser Interaction with Matter, 95430F (4 May 2015); doi: 10.1117/12.2182199; https://doi.org/10.1117/12.2182199
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