Presentation
5 October 2015 Using wafer-scale epitaxial graphene for producing twisted bilayers with controlled twist angle for electronics applications (Presentation Recording)
Author Affiliations +
Abstract
Graphene’s exceptional properties make it attractive for technological applications in many areas, including high-speed electronics. The establishment of processes for producing high quality, large-scale graphene is necessary for such applications. Large area growth of epitaxial graphene on the Si-face of hexagonal SiC (0001) wafers exhibits manageable growth kinetics, and most importantly, its azimuthal orientation is fixed, as it is determined by the structure of the single crystal substrate. Therefore, this is a viable method for producing graphene with uniform coverage and structural coherence at wafer-scale.[1],[2] Semi-insulating SiC is a good substrate for graphene RF transistors, however, its cost is so high that potentially only niche applications of graphene on SiC (e.g. defense or space related) can be viable. Furthermore, to enable hybrid electronics, where standard circuits built on Si perform digital logic functions while graphene that does not exhibit a band gap is used for ultrafast analog devices, we would need to transfer epitaxial graphene onto Si wafers. To address these issues, we have developed a method in which a graphene film grown on a 4” SiC wafer is exfoliated via the stress induced by an overgrown Ni film and transferred to other substrates, resulting in a wafer-scale monolayer of graphene that is continuous and has a single azimuthal orientation.[3] This growth and transfer process can be repeated on the same SiC wafer hundreds to thousands of times, dramatically reducing the cost per wafer-sized graphene layer. The characterization of the transferred films shows that they are of quality similar to the pristine films on SiC. Capitalizing on this new method for single crystal epitaxial graphene transfer, we have initiated a project to produce bilayers of graphene with deterministically controlled twist angles. The inspiration for this experimental work is recent theoretical work by Maroudas and coworkers4 that predicts the opening of substantial band gaps at specific twist angles in bilayer graphene. We will report our methods for producing twisted bilayers with controlled twist angle, their characterization and device results. [1] C. Dimitrakopoulos, Y.-M. Lin, A. Grill, D. B. Farmer, M. Freitag, Y. Sun, S.-J. Han, Z. Chen, K. A. Jenkins, Y. Zhu, Z. Liu, T. J. McArdle, J. A. Ott, R. Wisnieff, Ph. Avouris J. Vac. Sci. Technol. B 28, 985-992, (2010). [2] Y.-M. Lin, C. Dimitrakopoulos, K. A. Jenkins, D. B. Farmer, H.-Y. Chiu, Ph. Avouris Science 327, 662 (2010). [3] J. Kim, H. Park, J. B. Hannon, S. W. Bedell, K. Fogel, D. K. Sadana, C. Dimitrakopoulos Science 342, 833-836 (2013). [4] A. R. Muniz, D. Maroudas Phys. Rev. B 86, 075404 (2012)
Conference Presentation
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Christos D. Dimitrakopoulos "Using wafer-scale epitaxial graphene for producing twisted bilayers with controlled twist angle for electronics applications (Presentation Recording)", Proc. SPIE 9552, Carbon Nanotubes, Graphene, and Emerging 2D Materials for Electronic and Photonic Devices VIII, 955203 (5 October 2015); https://doi.org/10.1117/12.2187770
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KEYWORDS
Graphene

Silicon carbide

Semiconducting wafers

Electronics

Crystals

Silicon

Defense and security

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