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18 September 2015 The effect of thermal annealing on additive migration to the organic/metal interface in OPVs
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Abstract
The power conversion efficiency of solar cells based on conjugated polymer:fullerene derivative donor:acceptor bulk heterojunctions is not yet sufficient for commercialization. The two most common techniques used to enhance cell performances are thermal treatments and utilization of interlayers. In this work we investigated the effect of the sequence of thermal annealing and the metal evaporation on interlayer formation induced by additives migration toward the metal/organic interface. For this purpose we chose to study P3HT:PCBM:PEG blends, on which we performed thermal annealing before or after the Al cathode deposition. We further characterized the device performances and determined, by XPS, the blend/Al interfacial compositions. We conclude that thermal annealing before Al deposition inhibits the migration of PEG to the organic/metal interface in the P3HT:PCBM:PEG system, while annealing after the Al deposition enhances it. Thus, our study reveals that there is a great significance in the sequence of which the thermal annealing and the cathode deposition are performed in additive-containing organic blends, on the interlayer formation, and as a result, on the device performance.
Conference Presentation
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
J. Vinokur, I. Deckman, S. Obuchovsky, K. Weinfeld, and G. L. Frey "The effect of thermal annealing on additive migration to the organic/metal interface in OPVs", Proc. SPIE 9567, Organic Photovoltaics XVI, 95670X (18 September 2015); https://doi.org/10.1117/12.2189895
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