23 September 2015 A miniaturized laser illumination module
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Abstract
We present a wafer-based technology for mass production of miniaturized laser units. Heart of the approach is a glass wafer, comprising a metal structure acting as electrical contact, optical aperture and mechanical carrier of up to several thousands of flipped surface emitting laser diodes on one side, and a polymer-on-glass micro optical array on the other side. Mounting and characterization methods performed on wafer level are presented. After separation the size of a single laser unit is as small as 640 x 700 x 1400 μm3 and achieves spot diameters below 1 mm at distance of 120 mm. Performance and excellent cost potential allows for application in optical micro sensors and consumer electronics.
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A. T. Winzer, A. T. Winzer, J. Freitag, J. Freitag, P. Dannberg, P. Dannberg, M. Hintz, M. Hintz, M. Schädel, M. Schädel, V. Sandhya, V. Sandhya, H.-J. Freitag, H.-J. Freitag, } "A miniaturized laser illumination module", Proc. SPIE 9626, Optical Systems Design 2015: Optical Design and Engineering VI, 96261X (23 September 2015); doi: 10.1117/12.2191318; https://doi.org/10.1117/12.2191318
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