OptiPro has performed extensive process development work to understand how to grind and polish aspheres at production speeds with minimized process signatures. For example, the amount of stock removed from a substrate using a sub aperture polishing process can increase the amount of mid-spacial frequencies that can be detected. Through precise grind control, sub aperture, and mid-aperture polishing process research, OptiPro developed a detailed knowledge of asphere process control. One of the outcomes of this work has led OptiPro to develop an asphere polishing head for their 160A polishing platform which allows more process flexibility and control.
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Jay Tierson, Ed Fess, Greg Matthews, "Developments in precision asphere manufacturing," Proc. SPIE 9633, Optifab 2015, 96330H (11 October 2015);