Silicon is an optical material widely used in the production of infrared optics. However, silicon as a brittle material exhibits some difficulties when ultra-precision machined by mono-crystalline single point diamond. Finish turning of silicon with mono- crystalline diamond inserts results in accelerated tool wear rates if the right combination of the machining parameters is not properly selected. In this study, we conducted a series of machining tests on an ultra-high precision machine tool using finish turning conditions when using mono-crystalline diamond inserts with negative rake angle and relatively big nose radius. The study yields some recommendations on the best combination of machining parameters that will result in maximum material removal rates with smallest possible surface finish. In this work, standard non-controlled waviness diamond inserts having nose radius of about 1.5 mm, rake angle of negative 25°, and clearance angle of 5° were used to produce flat surfaces on silicon disk. From the results, it has been established that feed rate has the most influential effect followed by the depth of cut and cutting speed.