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12 October 2015 Recent progress in bound-abrasive polishing of fused silica glass
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Proceedings Volume 9633, Optifab 2015; 963327 (2015) https://doi.org/10.1117/12.2197485
Event: SPIE Optifab, 2015, Rochester, New York, United States
Abstract
The progress in the polishing of glass, in particular fused silica glass, with bound-abrasive is reviewed in the paper. The technique is rather successful in some respects, e.g. material removal rate, surface roughness, flatness of substrates. The surface roughness can be as low as <0.5nm (Ra) comparable with loose pad/pitch polishing for fused silica. On the other hand, the material removal rate is so high that the ground surface can be polished to specular (Ra:1~2nm) within a quarter of an hour. The technique can be adapted to polish plane, spherical, aspheric surfaces and even free-form surface. The technique is next to free of subsurface damage after slightly wet chemical etching. Because ceria is utilized as abrasives and epoxy resin as binding materials softer than or comparable to fused silica, the shape of the polishing tools is easy to be shaped and dressed and need no truing. The technique may provide a potential solution to fast polishing of glass.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yaguo Li "Recent progress in bound-abrasive polishing of fused silica glass", Proc. SPIE 9633, Optifab 2015, 963327 (12 October 2015); https://doi.org/10.1117/12.2197485
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