12 October 2015 Polishing performances of different optics with different size powder and different pH value slurries during CMP polishing
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Proceedings Volume 9633, Optifab 2015; 96332O (2015) https://doi.org/10.1117/12.2218455
Event: SPIE Optifab, 2015, Rochester, New York, United States
Abstract
Different size polishing powder and different pH value ceria slurries were used to polish fused silica glass、K9 glass and Nd-doped glass on pitch plate. Material removal rates (MRR) of glass polished with different size powder and various pH value slurries, and textures of each sample were characterized. The results show that powder size has an effect on glass polishing performance: scratch densities increase with the increase of polishing powder size; surface textures become rougher with the increase of the size of polishing powder. The slurry pH value also affects glass polishing performance: MRR of fused silica glass are lowest under any pH value slurry while Nd-doped glass has the largest MRR; removal rates of all three kinds of glass will rise under both acidic and alkaline condition. Near neutral polishing environment and smaller size powder are useful for the surface polishing process. The results further reveal polishing mechanism and provide the guidance for glass surface process.
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Jun Cao, Jun Cao, Chaoyang Wei, Chaoyang Wei, Shijie Liu, Shijie Liu, Aihuan Dun, Aihuan Dun, Minghong Yang, Minghong Yang, Xueke Xu, Xueke Xu, Jianda Shao, Jianda Shao, "Polishing performances of different optics with different size powder and different pH value slurries during CMP polishing", Proc. SPIE 9633, Optifab 2015, 96332O (12 October 2015); doi: 10.1117/12.2218455; https://doi.org/10.1117/12.2218455
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