EUV mask infrastructure readiness and gaps for TD and HVM

Ted Liang; John Magana; Kishore Chakravorty; Eric Panning; Guojing Zhang

doi:10.1117/12.2202724

11 November 2015 EUV mask infrastructure readiness and gaps for TD and HVM

Ted Liang, John Magana, Kishore Chakravorty, Eric Panning, Guojing Zhang

Proceedings Volume 9635, Photomask Technology 2015; 963509 (2015) https://doi.org/10.1117/12.2202724
Event: SPIE Photomask Technology, 2015, Monterey, California, United States

Abstract

The industry is transitioning EUV lithography from feasibility phase to technology development. EUV mask infrastructure needs to be prepared to support the technology development and ready to enable the implementation of EUV lithography for production. In this paper, we review the current status and assess the readiness of key infrastructure modules in EUV mask fabrication, inspection and control, and usage in a mask cycle: blank quality and inspection, pattern inspection, defect disposition and repair, pellicle integration, and handling of pelliclized masks.

Citation Download Citation

Ted Liang, John Magana, Kishore Chakravorty, Eric Panning, and Guojing Zhang "EUV mask infrastructure readiness and gaps for TD and HVM", Proc. SPIE 9635, Photomask Technology 2015, 963509 (11 November 2015); https://doi.org/10.1117/12.2202724

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