Paper
28 October 2015 Quantitative analysis of CD degradation induced by the fogging effect in e-beam lithography
Shao-Wen Chang, Tzu-Yi Wang, Ta-Cheng Lien, Chia-Jen Chen, Chih-Cheng Lin, Sin-Chang Lee, Anthony Yen
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Abstract
In this paper, a quantitative method to analyze the effective range of fogging effect from massive data is presented. According to the calculated effective range, we use two approaches to correct the pattern-dependent CD error that come from e-beam writing. One is the fogging effect correction(FEC), which uses a Gaussian distributed model to describe FE. Second, we implement dosage modulation based on the assumption that the error caused by FE is linearly proportional to the pattern density of a mask. In summary, we are able to successfully predict the map of CD error for various layouts, and correct the error caused by FE in mask-making.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Shao-Wen Chang, Tzu-Yi Wang, Ta-Cheng Lien, Chia-Jen Chen, Chih-Cheng Lin, Sin-Chang Lee, and Anthony Yen "Quantitative analysis of CD degradation induced by the fogging effect in e-beam lithography", Proc. SPIE 9635, Photomask Technology 2015, 96350I (28 October 2015); https://doi.org/10.1117/12.2197838
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Cited by 2 scholarly publications.
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KEYWORDS
Critical dimension metrology

Photomasks

Electron beam lithography

Forward error correction

Modulation

Quantitative analysis

Etching

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