22 August 2015 Research on ultrasonic vibration aided femtosecond laser machining process of transparent materials
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Proceedings Volume 9656, International Symposium on Photonics and Optoelectronics 2015; 965606 (2015) https://doi.org/10.1117/12.2196950
Event: International Symposium on Photonics and Optics, 2015, Shanghai, China
Abstract
A new process of femtosecond laser micromachining with ultrasonic vibration aided is proposed. An ultrasonic aided device has been designed, and the laser micromachining experiments of transparent materials have been carried out. The effects of the ultrasonic vibration with different power on surface quality and the drilling depth have been investigated, and the mechanism of the ultrasonic vibration aided laser machining has been analyzed. After introducing the ultrasonic vibration device, the residue debris on surface of the ablated trench is significantly reduced, and the drilling depth is increased. These results show that, ultrasonic vibration can effectively improve the surface quality of material processing, increase the depth of the drilling hole and promote the processing efficiency of the femtosecond laser.
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Yutang Dai, Yutang Dai, Bin Liu, Bin Liu, Guanglin Yin, Guanglin Yin, Tao Li, Tao Li, Joseph Muna Karanja, Joseph Muna Karanja, } "Research on ultrasonic vibration aided femtosecond laser machining process of transparent materials", Proc. SPIE 9656, International Symposium on Photonics and Optoelectronics 2015, 965606 (22 August 2015); doi: 10.1117/12.2196950; https://doi.org/10.1117/12.2196950
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