9 July 2015 Pitch-based pattern splitting for 1D layout
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The pattern splitting algorithm for 1D Gridded-Design-Rules layout (1D layout) for sub-10 nm node logic devices is shown. It is performed with integer linear programming (ILP) based on the conflict graph created from a grid map for each designated pitch. The relation between the number of times for patterning and the minimum pitch is shown systematically with a sample pattern of contact layer for each node. From the result, the number of times for patterning for 1D layout is fewer than that for conventional 2D layout. Moreover, an experimental result including SMO and total integrated process with hole repair technique is presented with the sample pattern of contact layer whose pattern density is relatively high among critical layers (fin, gate, local interconnect, contact, and metal).
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ryo Nakayama, Ryo Nakayama, Hiroyuki Ishii, Hiroyuki Ishii, Koji Mikami, Koji Mikami, Koichiro Tsujita, Koichiro Tsujita, Hidetami Yaegashi, Hidetami Yaegashi, Kenichi Oyama, Kenichi Oyama, Michael C. Smayling, Michael C. Smayling, Valery Axelrad, Valery Axelrad, } "Pitch-based pattern splitting for 1D layout", Proc. SPIE 9658, Photomask Japan 2015: Photomask and Next-Generation Lithography Mask Technology XXII, 96580A (9 July 2015); doi: 10.1117/12.2192529; https://doi.org/10.1117/12.2192529

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