9 July 2015 Challenges and requirements of mask data processing for multi-beam mask writer
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To overcome the resolution and throughput of current mask writer for advanced lithography technologies, the platform of e-beam writer have been evolved by the developments of hardware and software in writer. Especially, aggressive optical proximity correction (OPC) for unprecedented extension of optical lithography and the needs of low sensitivity resist for high resolution result in the limit of variable shaped beam writer which is widely used for mass production. The multi-beam mask writer is attractive candidate for photomask writing of sub-10nm device because of its high speed and the large degree of freedom which enable high dose and dose modulation for each pixel. However, the higher dose and almost unlimited appetite for dose modulation challenge the mask data processing (MDP) in aspects of extreme data volume and correction method. Here, we discuss the requirements of mask data processing for multi-beam mask writer and presents new challenges of the data format, data flow, and correction method for user and supplier MDP tool.
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Jin Choi, Jin Choi, Dong Hyun Lee, Dong Hyun Lee, Sinjeung Park, Sinjeung Park, SookHyun Lee, SookHyun Lee, Shuichi Tamamushi, Shuichi Tamamushi, In Kyun Shin, In Kyun Shin, Chan Uk Jeon, Chan Uk Jeon, } "Challenges and requirements of mask data processing for multi-beam mask writer", Proc. SPIE 9658, Photomask Japan 2015: Photomask and Next-Generation Lithography Mask Technology XXII, 96580C (9 July 2015); doi: 10.1117/12.2199274; https://doi.org/10.1117/12.2199274

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