29 July 2015 The investigation of thermal effect on dynamical shape changing of solder paste by using double-view digital holography
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Proceedings Volume 9659, International Conference on Photonics Solutions 2015; 965912 (2015) https://doi.org/10.1117/12.2196277
Event: International Conference on Photonics Solutions 2015, 2015, Hua Hin, Thailand
Abstract
In this paper we propose a modern technique to evaluate the shape changes of solder paste by using double-view in-line digital holography. We observed the transformation of three different kinds of solder paste composition: pure solder paste, solder paste mixed with 0.02%, 0.05%, 0.10% graphene (GPN) and 0.02%, 0.05%, 0.10% graphene oxide (GPNO), respectively. The shape of the solder pastes was investigated at different melt temperatures (i.e. 200°C, 250°C, and 300°C) for 30 seconds using a collimated beam propagating through the solder paste, then being double reflected on a mirror and second incident on another sides of the solder paste. The double images bearing beams were recorded with a CCD sensor simultaneously. The single recorded digital hologram from double view technique was reconstructed using digital holography. The results show that the double-view technique provides reliably data. Moreover, it would be developed for observing more than two images by single holography writing in the future.
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T. Thong-on, T. Thong-on, T. Prakobsang, T. Prakobsang, W. Pethsanthad, W. Pethsanthad, C. Boonsri, C. Boonsri, S. Plaipichit, S. Plaipichit, P. Buranasiri, P. Buranasiri, K. Yoshimori, K. Yoshimori, } "The investigation of thermal effect on dynamical shape changing of solder paste by using double-view digital holography", Proc. SPIE 9659, International Conference on Photonics Solutions 2015, 965912 (29 July 2015); doi: 10.1117/12.2196277; https://doi.org/10.1117/12.2196277
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