In this study, an original approach for DSA full chip mask optical proximity correction based on a skeleton representation of a guiding pattern is proposed. The cost function for an OPC process is based on minimizing the Central Placement Error (CPE), defined as the difference between an ideal skeleton target and a generated skeleton from a guiding contour. The high performance of this approach for DSA OPC full chip correction and its ability to minimize variability error on via placement is demonstrated and reinforced by the comparison with a rigorous model. Finally this Skeleton approach is highlighted as an appropriate tool for Design rules definition.
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L. Schneider, V. Farys, E. Serret, C. Fenouillet-Beranger, "Skeleton-based OPC application for DSA full chip mask correction," Proc. SPIE 9661, 31st European Mask and Lithography Conference, 966106 (4 September 2015);