Paper
4 September 2015 Optimization of rule-based OPC fragmentation to improve wafer image rippling
Author Affiliations +
Proceedings Volume 9661, 31st European Mask and Lithography Conference; 96610D (2015) https://doi.org/10.1117/12.2194755
Event: 31st European Mask and Lithography Conference, 2015, Eindhoven, Netherlands
Abstract
To provide insights into best practices of constructing an OPC recipe that suppresses wafer image rippling, we design versatile fragmentation rules with respect to the model-based resist image. Specifically, by recognizing that rippling effect exists before fragmentation, we conduct a coarse simulation with default engine settings and extract raw ripple sinusoidal components associated with signature geometries along all dimensions. The signal is predominantly optical, hence a good representation of the unfiltered diffraction. By referencing the rippling periodic features, we derive a global solution for fragmentation with full respect to geometrical boundary conditions. The methodology enables us to generate a robust fragmentation solution with minimum trial and error and improve target convergence especially along unfavorable dimensions.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jingyu Wang, Alexander Wei, Piyush Verma, and William Wilkinson "Optimization of rule-based OPC fragmentation to improve wafer image rippling", Proc. SPIE 9661, 31st European Mask and Lithography Conference, 96610D (4 September 2015); https://doi.org/10.1117/12.2194755
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Cited by 1 scholarly publication.
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KEYWORDS
Optical proximity correction

Photomasks

Semiconducting wafers

Solids

Lithography

Diffraction

Image segmentation

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