11 September 2015 Reliability tests of ultrasonic and thermosonic wire bonds
Author Affiliations +
Proceedings Volume 9662, Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2015; 966245 (2015) https://doi.org/10.1117/12.2205412
Event: XXXVI Symposium on Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments (Wilga 2015), 2015, Wilga, Poland
Abstract
This paper presents analysis of mechanical strength and reliability of wire bonds in context of the applied bonding technique, wire material and substrate type used as well as bonding parameters. The investigation conducted includes a selection of parameters affecting process of effective wire bonds forming by 53XX F&K Delvotec Bonder and implementation of wire bonds with ultrasonic and thermosonic techniques, using various substrates combined with gold and aluminum 25 μm diameter wires. Furthermore, reliability and quality test made by bond pull technique have been presented and discussed.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
T. Lizak, T. Lizak, A. Kociubiński, A. Kociubiński, } "Reliability tests of ultrasonic and thermosonic wire bonds", Proc. SPIE 9662, Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2015, 966245 (11 September 2015); doi: 10.1117/12.2205412; https://doi.org/10.1117/12.2205412
PROCEEDINGS
9 PAGES


SHARE
Back to Top