Direct metal transfer printing on flexible substrate for fabricating optics functional devices

Yingjie Jiang; Xiaohong Zhou; Feng Zhang; Zhenwu Shi; Linsen Chen; Changsi Peng

doi:10.1117/12.2199655

6 November 2015 Direct metal transfer printing on flexible substrate for fabricating optics functional devices

Yingjie Jiang, Xiaohong Zhou, Feng Zhang, Zhenwu Shi, Linsen Chen, Changsi Peng

Proceedings Volume 9667, International Workshop on Thin Films for Electronics, Electro-Optics, Energy, and Sensors; 966707 (2015) https://doi.org/10.1117/12.2199655
Event: International Workshop on Thin Films for Electronics, Electro-Optics, Energy and Sensors, 2015, Suzhou, China

Abstract

New functional materials and devices based on metal patterns can be widely used in many new and expanding industries,such as flat panel displays, alternative energy,sensors and so on. In this paper, we introduce a new transfer printing method for fabricating metal optics functional devices. This method can directly transfer a metal pattern from a polyethylene terephthalate (PET)supported UV or polydimethylsiloxane (PDMS) pattern to another PET substrate. Purely taking advantage of the anaerobic UV curing adhesive (a-UV) on PET substrate, metal film can be easily peeled off from micro/nano-structured surface. As a result, metal film on the protrusion can be selectively transferred onto the target substrate, to make it the metal functional surface. But which on the bottom can not be transferred. This method provides low cost fabrication of metal thin film devices by avoiding high cost lithography process. Compared with conventional approach, this method can get more smooth rough edges and has wider tolerance range for the original master mold. Future developments and potential applications of this metal transfer method will be addressed.

Citation Download Citation

Yingjie Jiang, Xiaohong Zhou, Feng Zhang, Zhenwu Shi, Linsen Chen, and Changsi Peng "Direct metal transfer printing on flexible substrate for fabricating optics functional devices", Proc. SPIE 9667, International Workshop on Thin Films for Electronics, Electro-Optics, Energy, and Sensors, 966707 (6 November 2015); https://doi.org/10.1117/12.2199655

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