15 October 2015 Thermal research of infrared sight signal processing circuit board under temperature shock environment
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Proceedings Volume 9671, AOPC 2015: Advances in Laser Technology and Applications; 96710D (2015) https://doi.org/10.1117/12.2202353
Event: Applied Optics and Photonics China (AOPC2015), 2015, Beijing, China
Abstract
Thermal stability technology of signal processing circuit infrared sight is studied under temperature shock. Model parameters and geometry is configured for FPGA devices (EP1C20F400C8), solder material and PCB. Signal circuit boards of full array BGA distribution are simulated and analyzed by thermal shock and waveform through engineering finite element analysis software. Because solders of the whole model have strong stress along Y direction, initial stress constraints along Y direction are primarily considered when the partial model of single solder is imposed by thermal load. When absolute thermal loads stresses of diagonal nodes with maximum strains are separated from the whole model, interpolation is processed according to thermal loads circulation. Plastic strains and thermal stresses of nodes in both sides of partial model are obtained. The analysis results indicate that with thermal load circulation, maximum forces of each circulation along Y direction are increasingly enlarged and with the accumulation of plastic strains of danger point, the composition will become invalid in the end.
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Youtang Gao, Youtang Gao, Huang Ding, Huang Ding, Jianliang Qiao, Jianliang Qiao, Yuan Xu, Yuan Xu, Jun Niu, Jun Niu, } "Thermal research of infrared sight signal processing circuit board under temperature shock environment", Proc. SPIE 9671, AOPC 2015: Advances in Laser Technology and Applications, 96710D (15 October 2015); doi: 10.1117/12.2202353; https://doi.org/10.1117/12.2202353
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