15 October 2015 Research of new packaging and cooling technique for high power fiber laser used pump coupler
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Proceedings Volume 9671, AOPC 2015: Advances in Laser Technology and Applications; 96710T (2015) https://doi.org/10.1117/12.2199406
Event: Applied Optics and Photonics China (AOPC2015), 2015, Beijing, China
Abstract
This article analyzes the advantages and disadvantages of a packaging structure for pump coupler, where common heat conduction material is used. In this study, the possibility of using new technology of thermal conductivity is discussed. We also proposes a solution that make the function and effect of package more uniform. A serial of experiments are done for research the cooling effect and the working reliability of the fiber combiners and couplers. Experiment proves that after improved method of package, the cooling speed increases significantly comparing the sample with old type of package technique. The technique discussed in this paper will make the high power fiber laser working long time with steady power output and high efficiency.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Wei Mu, Wei Mu, Xu Si, Xu Si, Ya-jun Lin, Ya-jun Lin, Cheng-lin Xu, Cheng-lin Xu, Yun-liang Ma, Yun-liang Ma, Chun Xiao, Chun Xiao, } "Research of new packaging and cooling technique for high power fiber laser used pump coupler", Proc. SPIE 9671, AOPC 2015: Advances in Laser Technology and Applications, 96710T (15 October 2015); doi: 10.1117/12.2199406; https://doi.org/10.1117/12.2199406
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