Reliability is an important index to ensure the application of infrared focal plane arrays (IRFPAs) in complex environment, and it becomes a major bottleneck problem of IRFPAs’ development. Because of the characteristics such as type, nature, quantity, location and distribution et al, bad pixel which contains initial bad pixel and used bad pixel has outstanding advantage for failure analysis and reliability evaluation of IRFPAs. In this paper, the structure of IRPFAs has been introduced in detail, and the damage mechanisms of used bad pixel also have been analyzed deeply. At the same time, the feasibility to study IRPFAs' damage stress, failure position, damage mechanism has been discussed all around. The research of bad pixel can be used to optimize the structure and process, meanwhile it also can improve the accuracy of bad pixel identification and replacements.