25 October 2016 Simulation and analysis of image sensor's TEC cooling package based on ANSYS Icepak
Author Affiliations +
Proceedings Volume 9686, 8th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optoelectronic Materials and Devices; 968613 (2016) https://doi.org/10.1117/12.2242713
Event: Eighth International Symposium on Advanced Optical Manufacturing and Testing Technology (AOMATT2016), 2016, Suzhou, China
Abstract
In the use of image sensors such as CCD, CMOS and so on, the noise caused by thermal dark signal will influence the imaging results to a certain extent. Dark current noise exists in every photoelectric devices and it is directly related to the temperature. So it’s a principle way that cool the image sensors’ temperature to suppress the dark current noise. This article presents a kind of TEC cooling package integrated with four stages TEC, a heat sink and an insulating cavity, to meet the requirement of image sensors’ refrigeration. Theoretical analysis of this cooling package was done from the view of heat transfer. The modeling and thermal simulated analysis are performed by finite element simulation analysis software ANSYS Icepak, comparing the experimental results in the conditions of different ambient temperature, different heat load and vacuumizing or filling the cavity.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yuheng Wu, Yuheng Wu, Huachuang Wang, Huachuang Wang, } "Simulation and analysis of image sensor's TEC cooling package based on ANSYS Icepak", Proc. SPIE 9686, 8th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optoelectronic Materials and Devices, 968613 (25 October 2016); doi: 10.1117/12.2242713; https://doi.org/10.1117/12.2242713
PROCEEDINGS
7 PAGES


SHARE
Back to Top