High power diode laser array development using completely indium free packaging technology with narrow spectrum

Dong Hou; Jingwei Wang; Lijun Gao; Xuejie Liang; Xiaoning Li; Xingsheng Liu

doi:10.1117/12.2213928

22 April 2016 High power diode laser array development using completely indium free packaging technology with narrow spectrum

Dong Hou, Jingwei Wang, Lijun Gao, Xuejie Liang, Xiaoning Li, Xingsheng Liu

Author Affiliations +

Proceedings Volume 9730, Components and Packaging for Laser Systems II; 973009 (2016) https://doi.org/10.1117/12.2213928
Event: SPIE LASE, 2016, San Francisco, California, United States

Abstract

The high power diode lasers have been widely used in many fields. In this work, a sophisticated high power and high performance horizontal array of diode laser stacks have been developed and fabricated with high duty cycle using hard solder bonding technology. CTE-matched submount and Gold Tin (AuSn) hard solder are used for bonding the diode laser bar to achieve the performances of anti-thermal fatigue, higher reliability and longer lifetime. This array consists of 30 bars with the expected optical output peak power of 6000W. By means of numerical simulation and analytical results, the diode laser bars are aligned on suitable positions along the water cooled cooler in order to achieve the uniform wavelength with narrow spectrum and accurate central wavelength. The performance of the horizontal array, such as output power, spectrum, thermal resistance, life time, etc., is characterized and analyzed.

Citation Download Citation

Dong Hou, Jingwei Wang, Lijun Gao, Xuejie Liang, Xiaoning Li, and Xingsheng Liu "High power diode laser array development using completely indium free packaging technology with narrow spectrum", Proc. SPIE 9730, Components and Packaging for Laser Systems II, 973009 (22 April 2016); https://doi.org/10.1117/12.2213928

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