22 April 2016 Model-based adhesive shrinkage compensation for increased bonding repeatability
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Abstract
The assembly process of optical components consists of two phases – the alignment and the bonding phase. Precision - or better process repeatability - is limited by the latter one. The limitation of the alignment precision is given by the measurement equipment and the manipulation technology applied. Today’s micromanipulators in combination with beam imaging setups allow for an alignment in the range of far below 100nm. However, once precisely aligned optics need to be fixed in their position. State o f the art in optics bonding for laser systems is adhesive bonding with UV-curing adhesives. Adhesive bonding is a multi-factorial process and thus subject to statistical process deviations. As a matter of fact, UV-curing adhesives inherit shrinkage effects during their curing process, making offsets for shrinkage compensation mandatory. Enhancing the process control of the adhesive bonding process is the major goal of the activities described in this paper. To improve the precision of shrinkage compensation a dynamic shrinkage prediction is envisioned by Fraunhofer IPT. Intense research activities are being practiced to gather a deeper understanding of the parameters influencing adhesive shrinkage behavior. These effects are of different nature – obviously being the raw adhesive material itself as well as its condition, the bonding geometry, environmental parameters like surrounding temperature and of course process parameters such as curing properties. Understanding the major parameters and linking them in a model-based shrinkage-prediction environment is the basis for improved process control. Results are being deployed by Fraunhofer in prototyping, as well as volume production solutions for laser systems.
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Tobias Müller, Christian Schlette, Shunmuganathan Lakshmanan, Sebastian Haag, Daniel Zontar, Sebastian Sauer, Christian Wenzel, Christian Brecher, Jürgen Roβmann, "Model-based adhesive shrinkage compensation for increased bonding repeatability", Proc. SPIE 9730, Components and Packaging for Laser Systems II, 97300S (22 April 2016); doi: 10.1117/12.2212527; https://doi.org/10.1117/12.2212527
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