New cooler concepts with integrated electrical and mechanical interfaces have been investigated and offer advantages for high power system design.
The bonding process of chips on sub-mounts and coolers has been studied extensively and for a variety of solder materials. High quality of the interfaces as well as good reliability under normal operation and thermal cycling have been realized. A viable alternative to soldering is silver sintering. The very positive results which have been achieved with a variety of technologies indicate the robustness of the VCSEL chips and their suitability for high power systems.
Beam shaping micro-optics can be integrated on the VCSEL chip in a wafer scale process by replication of lenses in a polymer layer. The performance of VCSEL arrays with integrated collimation lenses has been positively evaluated and the integrated chips are fully compatible with all further assembly steps.
The integrated high power systems make the application even easier and more robust. New examples in laser material processing and pumping of solid state lasers are presented.