In this work, both methods of the laser writing for the selective plating of polymers were investigated and compared. For LDS approach, new material: polypropylene with carbon-based additives was tested using picosecond and nanosecond laser pulses. Different laser processing parameters (laser pulse energy, scanning speed, the number of scans, pulse durations, wavelength and overlapping of scanned lines) were applied in order to find out the optimal regime of activation. Areal selectivity tests showed a high plating resolution. The narrowest width of a copper-plated line was less than 23 μm. Finally, our material was applied to the prototype of the electronic circuit board on a 2D surface.
ACCESS THE FULL ARTICLE
K. Ratautas, M. Gedvilas, I. Stankevičiene, A. Jagminienė, E. Norkus, N. Li Pira, S. Sinopoli, U. Emanuele, G. Račiukaitis, "Laser-induced selective copper plating of polypropylene surface," Proc. SPIE 9735, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXI, 973507 (14 March 2016);