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14 March 2016 Time-optimized laser micro machining by using a new high dynamic and high precision galvo scanner
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High accuracy, quality and throughput are key factors in laser micro machining. To obtain these goals the ablation process, the machining strategy and the scanning device have to be optimized. The precision is influenced by the accuracy of the galvo scanner and can further be enhanced by synchronizing the movement of the mirrors with the laser pulse train. To maintain a high machining quality i.e. minimum surface roughness, the pulse-to-pulse distance has also to be optimized. Highest ablation efficiency is obtained by choosing the proper laser peak fluence together with highest specific removal rate. The throughput can now be enhanced by simultaneously increasing the average power, the repetition rate as well as the scanning speed to preserve the fluence and the pulse-to-pulse distance. Therefore a high scanning speed is of essential importance. To guarantee the required excellent accuracy even at high scanning speeds a new interferometry based encoder technology was used, that provides a high quality signal for closed-loop control of the galvo scanner position. Low inertia encoder design enables a very dynamic scanner system, which can be driven to very high line speeds by a specially adapted control solution. We will present results with marking speeds up to 25 m/s using a f = 100 mm objective obtained with a new scanning system and scanner tuning maintaining a precision of about 5 μm. Further it will be shown that, especially for short line lengths, the machining time can be minimized by choosing the proper speed which has not to be the maximum one.
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Beat Jaeggi, Beat Neuenschwander, Markus Zimmermann, Markus Zecherle, and Ernst W. Boeckler "Time-optimized laser micro machining by using a new high dynamic and high precision galvo scanner", Proc. SPIE 9735, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXI, 973513 (14 March 2016);

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