Laser assisted micro-welding of ultra-thin glass wafers

V. Hevonkorpi; H. Lundén; A. Määttänen

doi:10.1117/12.2207898

4 March 2016 Laser assisted micro-welding of ultra-thin glass wafers

V. Hevonkorpi, H. Lundén, A. Määttänen

Proceedings Volume 9736, Laser-based Micro- and Nanoprocessing X; 973602 (2016) https://doi.org/10.1117/12.2207898
Event: SPIE LASE, 2016, San Francisco, California, United States

Abstract

The use of glass in semiconductor industry has been growing during the past years and the grow is estimated to continue and accelerate considerably during the coming years. For efficient manufacturing, especially when using ultra-thin wafers, novel bonding technologies are needed. In this paper, a laser assisted additive free glass-glass welding technology is presented. Furthermore, the use of laser assisted welding to manufacture hermetic packages for optical components is investigated. The reliability and robustness of the weld and the process is verified by damp heat (85 °C at 85% RH) testing. A large quantity, one hundred samples, was tested to define the repeatability of the welding process. D263T, a glass type commonly used in manufacturing consumer products, was selected.

Glass-glass welding proved to be a reliable bonding method offering a non-outgassing, room temperature bonding. In addition, it was verified that the weld is hermetic having a good resistance to high temperature and moisture conditions. No changes in the welding seams were observed during or after damp heat testing.

Citation Download Citation

V. Hevonkorpi, H. Lundén, and A. Määttänen "Laser assisted micro-welding of ultra-thin glass wafers", Proc. SPIE 9736, Laser-based Micro- and Nanoprocessing X, 973602 (4 March 2016); https://doi.org/10.1117/12.2207898

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