4 March 2016 Formation of copper micropatterns by laser direct writing using copper nanoparticle ink
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Proceedings Volume 9736, Laser-based Micro- and Nanoprocessing X; 97360D (2016) https://doi.org/10.1117/12.2211215
Event: SPIE LASE, 2016, San Francisco, California, United States
Abstract
The 2D and 3D laser direct writing using Cu nanoparticle ink were studied using a compact blue-violet semiconductor laser. The laser direct writing based on a motion controller and G-code language program on PC enabled to prepare various kinds of shaped Cu grids which can be easily designed on-demand. A Cu grid pattern was prepared on a flexible and transparent polymer substrate and applied to a stress sensor. A star-shaped grid was fabricated a polymer substrate and the performance as a stress sensor for detecting the motion of human hand devises was demonstrated toward wearable electronics. In the preliminary 3D study, we have employed the layer-by-layer formation of a 3D structure, where cycle of the spin-coating of a metal nanoparticle ink and the laser direct writing were repeated. The 3D microstructures prepared by the 3D laser direct writing using Ag and Cu nanoparticle inks suggested the possibility of a 3D interconnection.
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Akira Watanabe, Jinguang Cai, Gang Qin, Lidan Fan, "Formation of copper micropatterns by laser direct writing using copper nanoparticle ink", Proc. SPIE 9736, Laser-based Micro- and Nanoprocessing X, 97360D (4 March 2016); doi: 10.1117/12.2211215; https://doi.org/10.1117/12.2211215
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