4 March 2016 Ultra high-speed micromachining of transparent materials using high PRF ultrafast lasers and new resonant scanning systems
Author Affiliations +
Proceedings Volume 9736, Laser-based Micro- and Nanoprocessing X; 97360N (2016) https://doi.org/10.1117/12.2212816
Event: SPIE LASE, 2016, San Francisco, California, United States
Abstract
Irradiation of focused laser pulses to transparent materials leads to structural changes and can be used for the fabrication of e.g. LED light guiding components. In these applications both small spot sizes and a high lateral resolution in the μm range are absolutely essential. In order to achieve the industrially required throughput of nearly one million laser markings per second, ultrafast lasers with 100 W of average power and pulse repetition frequencies of several MHz are required. Laser machining of polymers additionally necessitates a wide spatial separation of the markings to avoid heat accumulation effects. Therefore, neither commercially available galvanometer based nor Polygon based scanners with their limited scan speed can be used for beam deflection. In our work, we developed an experimental setup based
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
F. Harth, F. Harth, M. C. Piontek, M. C. Piontek, T. Herrmann, T. Herrmann, J. A. L'huillier, J. A. L'huillier, "Ultra high-speed micromachining of transparent materials using high PRF ultrafast lasers and new resonant scanning systems", Proc. SPIE 9736, Laser-based Micro- and Nanoprocessing X, 97360N (4 March 2016); doi: 10.1117/12.2212816; https://doi.org/10.1117/12.2212816
PROCEEDINGS
10 PAGES


SHARE
Back to Top