4 March 2016 Throughput optimization for laser micro structuring
Author Affiliations +
Proceedings Volume 9736, Laser-based Micro- and Nanoprocessing X; 97360O (2016) https://doi.org/10.1117/12.2216849
Event: SPIE LASE, 2016, San Francisco, California, United States
Laser pulses in the picosecond and femtosecond regime enable nearly non-thermal material processing where heat effects like molten pools and thermal tensions are often significantly reduced. However, a residual amount of laser energy transforms into heat. As a consequence cumulative multiple shot processing leads to heat accumulation and subsequently lower manufacturing accuracy. To increase the processing throughput without losing quality, it is important to optimize the laser pulse properties and the ablation strategy to further reduce thermal effects. Due to a low heat capacity in small structures, it is necessary to consider the substrate dimensions while performing micro- and nanoprocessing. In contrast to bulk material ablation, the heat dissipation is confined by the small heat capacity of microstructures. Especially for complex structures, it is time-consuming to find efficient processing parameters manually. For this reason, an in-situ evaluation system based on electrical resistivity measurements for on-line control of the ablation process was developed to optimize the laser parameters. In the work presented, the efficiency of 35 femtosecond pulsed laser ablation was evaluated on copper structures in the micrometer range. Furthermore, these results have been compared and evaluated with surface profiles measured by white-light interferometry.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jan S. Hoppius, Jan S. Hoppius, A. Kanitz, A. Kanitz, E. L. Gurevich, E. L. Gurevich, A. Ostendorf, A. Ostendorf, "Throughput optimization for laser micro structuring", Proc. SPIE 9736, Laser-based Micro- and Nanoprocessing X, 97360O (4 March 2016); doi: 10.1117/12.2216849; https://doi.org/10.1117/12.2216849


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