4 March 2016 Analysis of process parameter for the ablation of optical glasses with femto- and picosecond laser pulses
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Proceedings Volume 9736, Laser-based Micro- and Nanoprocessing X; 973619 (2016) https://doi.org/10.1117/12.2212826
Event: SPIE LASE, 2016, San Francisco, California, United States
Abstract
Experiments with an ultrashort pulsed laser system emitting pulses ranging from 350 fs to 10 ps and a maximum average power of 50 W at 1030 nm are presented. The laser beam gets deflected by a galvanometric scan-system with maximum scan speed of 2500 mm/s and focused by F-theta lenses onto the substrates. By experiments the influences of pulse energy, fluence, laser wavelength, pulse length and material conditions on the target figures is analyzed. These are represented by the material characteristics mean squared roughness, ablation depths as well as the microcrack distribution in depth. The experimental procedure is applied onto a series of fused silica and SF6 samples.
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Christian Schindler, Christian Schindler, Maria Friedrich, Maria Friedrich, Jens Bliedtner, Jens Bliedtner, } "Analysis of process parameter for the ablation of optical glasses with femto- and picosecond laser pulses", Proc. SPIE 9736, Laser-based Micro- and Nanoprocessing X, 973619 (4 March 2016); doi: 10.1117/12.2212826; https://doi.org/10.1117/12.2212826
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