9 March 2016 Femtosecond lasers for machining of transparent, brittle materials: ablative vs. non-ablative femtosecond laser processing
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Abstract
This paper focuses on precision machining of transparent materials by means of ablative and non-ablative femtosecond laser processing. Ablation technology will be compared with a newly developed patent pending non-ablative femtosecond process, ClearShapeTM, using the Spectra-Physics Spirit industrial femtosecond laser.
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F. Hendricks, F. Hendricks, V. V. Matylitsky, V. V. Matylitsky, "Femtosecond lasers for machining of transparent, brittle materials: ablative vs. non-ablative femtosecond laser processing", Proc. SPIE 9740, Frontiers in Ultrafast Optics: Biomedical, Scientific, and Industrial Applications XVI, 97400Z (9 March 2016); doi: 10.1117/12.2212513; https://doi.org/10.1117/12.2212513
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