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9 March 2016 Engineering model for ultrafast laser microprocessing
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Ultrafast laser micro-machining relies on complex laser-matter interaction processes, leading to a virtually athermal laser ablation. The development of industrial ultrafast laser applications benefits from a better understanding of these processes. To this end, a number of sophisticated scientific models have been developed, providing valuable insights in the physics of the interaction. Yet, from an engineering point of view, they are often difficult to use, and require a number of adjustable parameters.

We present a simple engineering model for ultrafast laser processing, applied in various real life applications: percussion drilling, line engraving, and non normal incidence trepanning. The model requires only two global parameters. Analytical results are derived for single pulse percussion drilling or simple pass engraving. Simple assumptions allow to predict the effect of non normal incident beams to obtain key parameters for trepanning drilling. The model is compared to experimental data on stainless steel with a wide range of laser characteristics (time duration, repetition rate, pulse energy) and machining conditions (sample or beam speed). Ablation depth and volume ablation rate are modeled for pulse durations from 100 fs to 1 ps. Trepanning time of 5.4 s with a conicity of 0.15° is obtained for a hole of 900 μm depth and 100 μm diameter.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
E. Audouard and E. Mottay "Engineering model for ultrafast laser microprocessing", Proc. SPIE 9740, Frontiers in Ultrafast Optics: Biomedical, Scientific, and Industrial Applications XVI, 974016 (9 March 2016);

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