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14 March 2016 Design optimization of thin-film/wafer-based tandem junction solar cells using analytical modeling
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Several research groups are developing solar cells of varying designs and materials that are high efficiency as well as cost competitive with the single junction silicon (Si) solar cells commercially produced today. One of these solar cell designs is a tandem junction solar cell comprised of perovskite (CH3NH3PbI3) and silicon (Si). Loper et al.1 was able to create a 13.4% efficient tandem cell using a perovskite top cell and a Si bottom cell, and researchers are confident that the perovskite/Si tandem cell can be optimized in order to reach higher efficiencies without introducing expensive manufacturing processes. However, there are currently no commercially available software capable of modeling a tandem cell that is based on a thin-film based bottom cell and a wafer-based top cell. While PC1D2 and SCAPS3 are able to model tandem cells comprised solely of thin-film absorbers or solely of wafer-based absorbers, they result in convergence errors if a thin-film/wafer-based tandem cell, such as the perovskite/ Si cell, is modeled. The Matlab-based analytical model presented in this work is capable of modeling a thin-film/wafer-based tandem solar cell. The model allows a user to adjust the top and bottom cell parameters, such as reflectivity, material bandgaps, donor and acceptor densities, and material thicknesses, in order to optimize the short circuit current, open circuit voltage, and quantum efficiency of the tandem solar cell. Using the Matlab-based analytical model, we were able optimize a perovskite/Si tandem cell with an efficiency greater than 30%.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Lauren Davidson and Fatima Toor "Design optimization of thin-film/wafer-based tandem junction solar cells using analytical modeling", Proc. SPIE 9743, Physics, Simulation, and Photonic Engineering of Photovoltaic Devices V, 97430O (14 March 2016);

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