Paper
27 February 2016 The development of thin film metrology by coherence scanning interferometry
Hirokazu Yoshino, Roger Smith, John M. Walls, Daniel Mansfield
Author Affiliations +
Proceedings Volume 9749, Oxide-based Materials and Devices VII; 97490P (2016) https://doi.org/10.1117/12.2222883
Event: SPIE OPTO, 2016, San Francisco, California, United States
Abstract
Scanning White Light Interferometry (SWLI), now referred to as Coherence Scanning Interferometry (CSI), is established as a powerful tool for sub-nanometer surface metrology. The technique provides accurate and rapid three dimensional topographical analysis without contacting the surface under measurement. This paper will focus on recent developments of CSI using the Helical Complex Field (HCF) function that have extended its use for important thin film measurements. These developments now enable CSI to perform thin film thickness measurements, to measure the surface profile and the interfacial surface roughness of a buried interface and to derive optical constants (index of refraction n and extinction coefficient K).
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Hirokazu Yoshino, Roger Smith, John M. Walls, and Daniel Mansfield "The development of thin film metrology by coherence scanning interferometry", Proc. SPIE 9749, Oxide-based Materials and Devices VII, 97490P (27 February 2016); https://doi.org/10.1117/12.2222883
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Cited by 6 scholarly publications.
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KEYWORDS
Refractive index

3D metrology

Metrology

Objectives

Interferometry

Surface roughness

Radium

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