15 March 2016 Silicon photonics for 100 Gbit/s intra-data center optical interconnects
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Proceedings Volume 9753, Optical Interconnects XVI; 975308 (2016) https://doi.org/10.1117/12.2213386
Event: SPIE OPTO, 2016, San Francisco, California, United States
Abstract
We report on an ultra-compact co-integrated transmitter and receiver in SiGe BiCMOS technology for short reach optical interconnects. A fully integrated EPIC transceiver chip on silicon photonics technology is described. The chip integrates all photonic and electronic devices for an electro-optic transceiver and has been designed to be testable on wafer-scale. A node-matched diode modulator based on carrier injection is a key building block in the chip design. Its operation performance is presented with respect to insertion loss, signal-to-noise-ratio and power consumption at a 25.78125 Gbit/s in NRZ operation. A novel SiGe based photodetector exhibits a -3 dB bandwidth of up to 70 GHz and a responsivity of >1 A/W. Details are given about the process technology of co-integration of photonic and electronic integrated circuits using both silicon-on-insulator and bulk silicon. The implemented co-integration process requires only few additional process steps, leading to only a slight increase in complexity compared to conventional CMOS and BiCMOS baselines.
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Stefan Meister, Stefan Meister, Moritz Grehn, Moritz Grehn, Hanjo Rhee, Hanjo Rhee, Marco Vitali, Marco Vitali, Christoph Theiss, Christoph Theiss, Sebastian Kupijai, Sebastian Kupijai, Aws Al-Saadi, Aws Al-Saadi, Danilo Bronzi, Danilo Bronzi, Sven Otte, Sven Otte, Marvin Henniges, Marvin Henniges, David Selicke, David Selicke, Muhammad Atif, Muhammad Atif, Erik Schwartz, Erik Schwartz, Stefan Lischke, Stefan Lischke, David Stolarek, David Stolarek, Andreas Mai, Andreas Mai, Mehmet Kaynak, Mehmet Kaynak, Harald H. Richter, Harald H. Richter, Lars Zimmermann, Lars Zimmermann, "Silicon photonics for 100 Gbit/s intra-data center optical interconnects", Proc. SPIE 9753, Optical Interconnects XVI, 975308 (15 March 2016); doi: 10.1117/12.2213386; https://doi.org/10.1117/12.2213386
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