15 March 2016 Low latency, area, and energy efficient Hybrid Photonic Plasmonic on-chip Interconnects (HyPPI)
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Proceedings Volume 9753, Optical Interconnects XVI; 97530A (2016) https://doi.org/10.1117/12.2217284
Event: SPIE OPTO, 2016, San Francisco, California, United States
Abstract
In this paper we benchmark various interconnect technologies including electrical, photonic, and plasmonic options. We contrast them with hybridizations where we consider plasmonics for active manipulation devices, and photonics for passive propagation integrated circuit elements, and further propose another novel hybrid link that utilizes an on chip laser for intrinsic modulation thus bypassing electro-optic modulation. Link benchmarking proves that hybridization can overcome the shortcomings of both pure photonic and plasmonic links. We show superiority in a variety of performance parameters such as point-to-point latency, energy efficiency, capacity, ability to support wavelength division multiplexing, crosstalk coupling length, bit flow density and Capability-to-Latency-Energy-Area Ratio.
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Shuai Sun, Shuai Sun, Abdel-Hameed A. Badaway, Abdel-Hameed A. Badaway, Vikram Narayana, Vikram Narayana, Tarek El-Ghazawi, Tarek El-Ghazawi, Volker J. Sorger, Volker J. Sorger, "Low latency, area, and energy efficient Hybrid Photonic Plasmonic on-chip Interconnects (HyPPI)", Proc. SPIE 9753, Optical Interconnects XVI, 97530A (15 March 2016); doi: 10.1117/12.2217284; https://doi.org/10.1117/12.2217284
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