15 March 2016 Low-power chip-level optical interconnects based on bulk-silicon single-chip photonic transceivers
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Proceedings Volume 9753, Optical Interconnects XVI; 975315 (2016) https://doi.org/10.1117/12.2212465
Event: SPIE OPTO, 2016, San Francisco, California, United States
We present new scheme for chip-level photonic I/Os, based on monolithically integrated vertical photonic devices on bulk silicon, which increases the integration level of PICs to a complete photonic transceiver (TRx) including chip-level light source. A prototype of the single-chip photonic TRx based on a bulk silicon substrate demonstrated 20 Gb/s low power chip-level optical interconnects between fabricated chips, proving that this scheme can offer compact low-cost chip-level I/O solutions and have a significant impact on practical electronic-photonic integration in high performance computers (HPC), cpu-memory interface, 3D-IC, and LAN/SAN/data-center and network applications.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Gyungock Kim, Gyungock Kim, Hyundai Park, Hyundai Park, Jiho Joo, Jiho Joo, Ki-Seok Jang, Ki-Seok Jang, Myung-Joon Kwack, Myung-Joon Kwack, Sanghoon Kim, Sanghoon Kim, In Gyoo Kim, In Gyoo Kim, Sun Ae Kim, Sun Ae Kim, Jin Hyuk Oh, Jin Hyuk Oh, Jaegyu Park, Jaegyu Park, Sanggi Kim, Sanggi Kim, } "Low-power chip-level optical interconnects based on bulk-silicon single-chip photonic transceivers", Proc. SPIE 9753, Optical Interconnects XVI, 975315 (15 March 2016); doi: 10.1117/12.2212465; https://doi.org/10.1117/12.2212465

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