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13 February 2016 Sensors, nano-electronics and photonics for the Army of 2030 and beyond
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The US Army’s future operating concept will rely heavily on sensors, nano-electronics and photonics technologies to rapidly develop situational understanding in challenging and complex environments. Recent technology breakthroughs in integrated 3D multiscale semiconductor modeling (from atoms-to-sensors), combined with ARL’s Open Campus business model for collaborative research provide a unique opportunity to accelerate the adoption of new technology for reduced size, weight, power, and cost of Army equipment. This paper presents recent research efforts on multi-scale modeling at the US Army Research Laboratory (ARL) and proposes the establishment of a modeling consortium or center for semiconductor materials modeling. ARL’s proposed Center for Semiconductor Materials Modeling brings together government, academia, and industry in a collaborative fashion to continuously push semiconductor research forward for the mutual benefit of all Army partners.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Philip Perconti, W. C. Kirkpatrick Alberts II, Jagmohan Bajaj, Jonathan Schuster, and Meredith Reed "Sensors, nano-electronics and photonics for the Army of 2030 and beyond", Proc. SPIE 9755, Quantum Sensing and Nano Electronics and Photonics XIII, 975506 (13 February 2016);


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