18 March 2016 Progress in high-power high-speed VCSEL arrays
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Flip-chip bonding enables a unique architecture for two-dimensional arrays of VCSELs. Such arrays feature scalable power outputs and the capability to separately address sub-array regions while maintaining fast turn-on and turn-off response times. These substrate-emitting VCSEL arrays can also make use of integrated micro-lenses for beam shaping and directional control. Advances in the performance of these laser arrays will be reviewed and emerging applications are discussed.
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Richard F. Carson, Richard F. Carson, Mial E. Warren, Mial E. Warren, Preethi Dacha, Preethi Dacha, Thomas Wilcox, Thomas Wilcox, John G. Maynard, John G. Maynard, David J. Abell, David J. Abell, Kirk J. Otis, Kirk J. Otis, James A. Lott, James A. Lott, } "Progress in high-power high-speed VCSEL arrays", Proc. SPIE 9766, Vertical-Cavity Surface-Emitting Lasers XX, 97660B (18 March 2016); doi: 10.1117/12.2215009; https://doi.org/10.1117/12.2215009


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