Translator Disclaimer
18 March 2016 NXE pellicle: offering a EUV pellicle solution to the industry
Author Affiliations +
Towards the end of 2014, ASML committed to provide a EUV pellicle solution to the industry. Last year, during SPIE Microlithography 2015, we introduced the NXE pellicle concept, a removable pellicle solution that is compatible with current and future patterned mask inspection methods. This paper shows results of how we took this concept to a complete EUV pellicle solution for the industry. We will highlight some technical design challenges we faced developing the NXE pellicle and how we solved them. We will also present imaging results of pellicle exposures on a 0.33 NA NXE scanner system. In conjunction with the NXE pellicle, we will also present the supporting tooling we have developed to enable pellicle use.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.


EUV mask defect analysis from mask to wafer printing
Proceedings of SPIE (April 01 2013)
EUV mask particle adders during scanner exposure
Proceedings of SPIE (April 06 2015)
Towards reduced impact of EUV mask defectivity on wafer
Proceedings of SPIE (July 28 2014)
EUV progress toward HVM readiness
Proceedings of SPIE (March 18 2016)
ASML NXE pellicle update
Proceedings of SPIE (June 27 2019)
NXE pellicle: development update
Proceedings of SPIE (September 26 2016)

Back to Top