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1 April 2016 Investigation of coat-develop track system for placement error of contact hole shrink process
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Directed Self-Assembly (DSA) is a well-known candidate for next generation sub-15nm half-pitch lithography. [1-2] DSA processes on 300mm wafers have been demonstrated for several years, and have given a strong impression due to finer pattern results. [3-4] On t he other hand, specific issues with DSA processes have begun to be clear as a result of these recent challenges. [5-6] Pattern placement error, which means the pattern shift after DSA fabrication, is recognized as one of these typical issues. Coat-Develop Track systems contribute to the DSA pattern fabrication and also influence the DSA pattern performance.[4] In this study, the placement error was investigated using a simple contact-hole pattern and subsequent contact-hole shrink process implemented on the SOKUDO DUO track. Thus, we will show the placement error of contact-hole shrink using a DSA process and discuss the difference between DSA and other shrink methods.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Masahiko Harumoto, Harold Stokes, Yuji Tanaka, Koji Kaneyama, Charles Pieczulewski, Masaya Asai, Isabelle Servin, Maxime Argoud, Ahmed Gharbi, Celine Lapeyre, Raluca Tiron, and Cedric Monget "Investigation of coat-develop track system for placement error of contact hole shrink process", Proc. SPIE 9777, Alternative Lithographic Technologies VIII, 97770O (1 April 2016);

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