Enhanced patterning by tilted ion implantation

Sang Wan Kim; Peng Zheng; Kimihiko Kato; Leonard Rubin; Tsu-Jae King Liu

doi:10.1117/12.2218793

22 March 2016 Enhanced patterning by tilted ion implantation

Sang Wan Kim, Peng Zheng, Kimihiko Kato, Leonard Rubin, Tsu-Jae King Liu

Proceedings Volume 9777, Alternative Lithographic Technologies VIII; 97771B (2016) https://doi.org/10.1117/12.2218793
Event: SPIE Advanced Lithography, 2016, San Jose, California, United States

Abstract

Tilted ion implantation (TII) is proposed as a lower-cost alternative to self-aligned double patterning (SADP) for pitch halving. This new approach is based on an enhancement in etch rate of a hard-mask layer by implant-induced damage. Ar⁺ implantation into a thin layer of silicon dioxide (SiO₂) is shown to enhance its etch rate in dilute hydrofluoric acid (HF) solution, by up to 9× for an implant dose of 3×10¹⁴ cm^-2. The formation of sub-lithographic features defined by masked tilted Ar⁺ implantation into a SiO₂ hard-mask layer is experimentally demonstrated. Features with sizes as small as ~21 nm, self-aligned to the lithographically patterned mask, are achieved. As compared with SADP, enhanced patterning by TII requires far fewer and lower-cost process steps and hence is expected to be much more cost-effective.

Citation Download Citation

Sang Wan Kim, Peng Zheng, Kimihiko Kato, Leonard Rubin, and Tsu-Jae King Liu "Enhanced patterning by tilted ion implantation", Proc. SPIE 9777, Alternative Lithographic Technologies VIII, 97771B (22 March 2016); https://doi.org/10.1117/12.2218793

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