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24 March 2016 Hybrid enabled thin film metrology using XPS and optical
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Complexity of process steps integration and material systems for next-generation technology nodes is reaching unprecedented levels, the appetite for higher sampling rates is on the rise, while the process window continues to shrink. Current thickness metrology specifications reach as low as 0.1A for total error budget – breathing new life into an old paradigm with lower visibility for past few metrology nodes: accuracy. Furthermore, for advance nodes there is growing demand to measure film thickness and composition on devices/product instead of surrogate planar simpler pads. Here we extend our earlier work in Hybrid Metrology to the combination of X-Ray based reference technologies (high performance) with optical high volume manufacturing (HVM) workhorse metrology (high throughput). Our stated goal is: put more “eyes” on the wafer (higher sampling) and enable move to films on pattern structure (control what matters). Examples of 1X front-end applications are used to setup and validate the benefits.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Alok Vaid, Givantha Iddawela, Sridhar Mahendrakar, Michael Lenahan, Mainul Hossain, Padraig Timoney, Abner F. Bello, Cornel Bozdog, Heath Pois, Wei Ti Lee, Mark Klare, Michael Kwan, Byung Cheol Kang, Paul Isbester, Matthew Sendelbach, Naren Yellai, Prasad Dasari, and Tom Larson "Hybrid enabled thin film metrology using XPS and optical", Proc. SPIE 9778, Metrology, Inspection, and Process Control for Microlithography XXX, 97780M (24 March 2016);

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