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24 March 2016 Enhacement of intrafield overlay using a design based metrology system
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As the scales of the semiconductor devices continue to shrink, accurate measurement and control of the overlay have been emphasized for securing more overlay margin. Conventional overlay analysis methods are based on the optical measurement of the overlay mark. However, the overlay data obtained from these optical methods cannot represent the exact misregistration between two layers at the circuit level. The overlay mismatch may arise from the size or pitch difference between the overlay mark and the real pattern. Pattern distortion, caused by CMP or etching, could be a source of the overlay mismatch as well. Another issue is the overlay variation in the real circuit pattern which varies depending on its location. The optical overlay measurement methods, such as IBO and DBO that use overlay mark on the scribeline, are not capable of defining the exact overlay values of the real circuit. Therefore, the overlay values of the real circuit need to be extracted to integrate the semiconductor device properly. The circuit level overlay measurement using CDSEM is time-consuming in extracting enough data to indicate overall trend of the chip. However DBM tool is able to derive sufficient data to display overlay tendency of the real circuit region with high repeatability. An E-beam based DBM(Design Based Metrology) tool can be an alternative overlay measurement method.

In this paper, we are going to certify that the overlay values extracted from optical measurement cannot represent the circuit level overlay values. We will also demonstrate the possibility to correct misregistration between two layers using the overlay data obtained from the DBM system.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Gyoyeon Jo, Sunkeun Ji, Shinyoung Kim, Hyunwoo Kang, Minwoo Park, Sangwoo Kim, Jungchan Kim, Chanha Park, Hyunjo Yang, Kotaro Maruyama, and Byungjun Park "Enhacement of intrafield overlay using a design based metrology system", Proc. SPIE 9778, Metrology, Inspection, and Process Control for Microlithography XXX, 97781J (24 March 2016);

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